Development Systems

Rapid development systems from X-ES simplify and streamline the development process to enable projects to get started quickly. Configured with COTS boards specific to your application and a Board Support Package (BSP) backed by a highly-responsive team of support engineers, system development has never been easier.

To find out more about the X-ES Development Systems available; click the details tab below

 

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Development Systems & Enclosures

Please view X-ES Development Systems range of products.

 

NameXPand1404Xpand1400 SeriesXPand1303
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DescriptionDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules

The XPand1404 provides access to the I/O available on the COM Express® module. With the XPand1404, the transition from development to the target system or custom COM Express® carrier card is made easy.
Development Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules

The XPand1400 Series COM Express® development platform targets the X-ES Small Form Factor (SFF) XPand6000 Series and other COM Express® applications to enable early development and rapid prototyping. It provides a convenient desktop setup with standard I/O connectors.
3U VPX Development Platform for Up to Eight Air-Cooled Modules

This platform supports up to eight 0.8 in. or 1.0 in. pitch air-cooled VPX (VITA 48.1) modules. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3.3 V. Up to 20 CFM of airflow is provided per slot.
Form FactorCOM Express, PCIe Edge CardCOM Express, PCIe Edge Card, PMC,XMC3U VPX
Chassis TypeDevelopmentDevelopmentDevelopment
No of Slots128
Dimensions19.3"L x 15.43"W x 8.15" H21.5"L x 9"W x 20.5" H11.6"L x 13.5"W x 13.5"H
Chassis CoolingForced Convection CooledForced Convection CooledForced Convection Cooled
Linkhttps://www.xes-inc.com/products/development-systems/xpand1404/https://www.xes-inc.com/products/development-systems/xpand1400series/https://www.xes-inc.com/products/development-systems/xpand1303/
NameXPand1301XPand1300 XPand1203
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Description3U CompactPCI Development Platform for Up to Eight Air-Cooled Modules

This platform supports up to eight 0.8 in. or 1.0 in. pitch air-cooled CompactPCI modules.

It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5 V, and up to 40 A on 3.3 V. The XPand1301 can provide up to 20 CFM of airflow per slot.
3U VPX Development Platform for Up to Eight Air-Cooled Modules

The XPand1300 is a low-cost, flexible, development platform. This platform supports up to eight 0.8 in. or 1.0 in. pitch air-cooled VPX (VITA 48.1) modules.

It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3.3 V. Up to 20 CFM of airflow is provided per slot.
3U VPX Development Platform for Up to Eight Conduction-Cooled Modules

The XPand1203 is a low-cost, flexible, development platform. This platform supports up to eight 0.8 in. or 1.0 in. pitch conduction-cooled VPX (VITA 48.2) modules.

It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3.3 V.
Form Factor3U CompactPCI 3U VPX3U VPX
Chassis TypeDevelopmentDevelopmentDevelopment
No of Slots888
Dimensions11.6"L x 13.5"W x 13.5"H11.5"L x 5.5"W x 16.5"H11.6"L x 13.5"W x 13.5"H
Chassis CoolingForced Convection CooledForced Convection CooledForced Convection Cooled
Linkhttps://www.xes-inc.com/products/development-systems/xpand1301/https://www.xes-inc.com/products/development-systems/xpand1300/https://www.xes-inc.com/products/development-systems/xpand1203/
NameXPand1202XPand1201XPand1200
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Description3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module

The XPand1202 provides a low-cost, flexible, VITA 67 development platform. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications.
3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules

The XPand1201 is a low-cost, flexible, development platform. This platform supports up to eight 0.8 in. or 1.0 in. pitch conduction-cooled CompactPCI modules.

It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5 V, and up to 40 A on 3.3 V.
3U VPX Development Platform for Up to Eight Conduction-Cooled Modules

The XPand1200 is a low-cost, flexible, development platform. This platform supports up to eight 0.8 in. or 1.0 in. pitch conduction-cooled VPX (VITA 48.2) modules.

It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3.3 V.
Form Factor3U VPX3U cPCI3U VPX
Chassis TypeDevelopmentDevelopmentDevelopment
No of Slots888
Dimensions11.5"L x 5.5"W x 16.5"H11.5"L x 5.5"W x 16.5"H11.5"L x 5.5"W x 16.5"H
Chassis CoolingForced Convection CooledForced Convection CooledForced Convection Cooled
Linkhttps://www.xes-inc.com/products/development-systems/xpand1202/https://www.xes-inc.com/products/development-systems/xpand1201/https://www.xes-inc.com/products/development-systems/xpand1200/
NameXPand1030XPand1011XPand1004
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Description3U cPCI Two-Slot Conduction-Cooled Development Platform for Cisco® 5940

The XPand1030 backplane provides CompactPCI bus between the two slots. Ethernet, RS-232 serial I/O, and DVI are routed to RJ-45, micro-DB-9, and HDMI connectors for easy access. The XPand1030 is the ideal solution for rapid prototyping mobile ad hoc networks (MANET) based on the Cisco® 5940 ESR. The 5940 3U cPCI hardware is complemented by Cisco IOS® Software and Cisco® Mobile Ready Net capabilities.
Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O

XPand1011 supports up to two 0.8 in. or 1.0 in. 6U VPX boards and utilises RTMs to simplify I/O access and support rapid system prototyping.

Power and reset LEDs are provided for system status. A momentary push button is provided for reset, and a switch is provided for DC power enable. Power can be provided via an ATX power supply or via the VPX VITA 62 power supply slot.
Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O

The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards, and utilises RTMs to simplify I/O access and support rapid system prototyping. Power and reset LEDs are provided for system status.
Form Factor3U cPCI 6U VPX3U VPX
Chassis TypeDevelopmentDevelopmentDevelopment
No of Slots222
Dimensions8.3"L x 4.2"W x8.5"H17.5"L x 5.6"W x 9.3"H11.9"L x 5.6"W x 9.3"H
Chassis CoolingForced Convection CooledForced Convection CooledForced Convection Cooled
Linkhttps://www.xes-inc.com/products/development-systems/xpand1030/https://www.xes-inc.com/products/development-systems/xpand1011/https://www.xes-inc.com/products/development-systems/xpand1004/
NameXTend3100Xtend2001XPand6200 Series Dev. Kit
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DescriptionDual XMC/PrPMC Carrier for Development and Testing

The XTend3100, in conjunction with a standard off-the-shelf ATX power supply, provides a complete desktop or benchtop PCI/PCI-X PrPMC and XMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis.
Dual-XMC Carrier for Development and Testing

The XTend2001 is designed to provide a low-cost and compact platform for XMC modules. In conjunction with a standard off-the-shelf ATX power supply, it provides a complete desktop or benchtop platform for development, evaluation, and testing.
Rapid Prototyping Development Kit for the XPand6200 Series Rugged Systems

The kit breaks out the XPand6200 Series' I/O to development-friendly commercial connectors and includes power supplies for powering the unit from standard 120 VAC wall outlets.
Form FactorPMC, XMCXMC3U VPX
Chassis TypeDevelopmentDevelopmentCustom
No of Slots222
Dimensions10.8"L x 9.3"W x 2.0"H6.55"L x 3.95"W x 0.83"H7.8"L x 3.4"W x 5.2"H
Chassis CoolingForced Convection CooledForced Convection CooledForced Convection Cooled
Linkhttps://www.xes-inc.com/products/development-systems/xtend3100/https://www.xes-inc.com/products/development-systems/xtend2001/https://www.xes-inc.com/products/development-systems/xpand6200seriesdevelopmentkit/
NameXPand9004
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DescriptionXPort6193 Solid-State Drive Module Development System

The XPand9004 provides convenient access to the XPort6193 Small Form Factor (SFF) Solid-State Drive (SSD) for development, drive imaging, or declassification. It can be connected to a desktop or laptop via eSATA. It also can be installed into a 3.5 in. drive bay, which is standard on most desktop PCs.
Form FactorCustom
Chassis TypeCustom
No of Slots1
Dimensions5.8"L x 3.5"W x 1.1"H
Chassis CoolingNatural Convection Cooling
Linkhttps://www.xes-inc.com/products/development-systems/xpand9004/

 

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