Rugged Embedded Computer RE1012

The Crystal Group’s RE1012 Rugged Embedded Computer is designed and tested with remote electrical substations in mind. Surge protection is built in and it is virtually maintenance free with top performance in harsh conditions including temperature extremes, high shock and vibration, and elements such as humidity, high altitudes, salt spray, and dust, to name just a few

 

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A pint-sized powerhouse, the high-performance RE1012 Rugged Embedded Computer from the Crystal Group combines a six-core Intel Xeon® D-1528 processor, up to 128GB of ECC DDR4 RAM, two internal 2.5-inch SATA solid-state drive (SSD) bays and one internal m.2 SSD bay, and flexible I/O in a rugged package measuring just 6.1 x 40.5 x 28 cm and weighs 3.4kg.

Its innovative fan-less design employs passively cooled heat-pipe technology and has no moving parts, reducing noise and maintenance. The RE1012 can be panel or rack mounted and comes with a variety of power options for AC and DC inputs.

Providing server-class performance in a compact, embedded footprint, this Rugged Embedded Computer couples a six-core Intel Xeon processor with data storage capacity in a fully customisable, scalable system to meet both current and future requirements.

The RE1012 is designed and tested with remote electrical substations in mind. Surge protection is built in.  It is virtually maintenance free with top performance in harsh conditions.   Such as temperature extremes, high shock and vibration, and elements such as humidity, high altitudes, salt spray, and dust, to name just a few.

Features of the RE1012 Fanless Rugged Embedded Computer

• Compact construction – 6.1 x 40.5 x 28 cm footprint
• Panel or rack mounting options
• Six (6) core Xeon D-1528 CPU
• Dual 2.5″ SSD hard drives
• Billet construction from milled and strain hardened 6061-T6511 structural aircraft aluminium
• IEEE 1613 and IEC 61850-3 certification ready

 

Specifications of the RE1012 Fanless Rugged Embedded Computer

 Environmental Standards 
MIL-STD-810, Operational Temperature-40°C to +40°C
MIL-STD-810, Storage, Method 501, Procedure I/II-40°C to +85°C
MIL-STD-810, Humidity, Method 507, Procedure II240 Hours with Humidity Kit
MIL-STD-810, Altitude, Method 50012,500ft operation, 40,000ft transport
MIL-STD-810, Vibration, Method 514, Procedure I5.5G, 10-2000Hz, 60 min/axis, 3 axes
MIL-STD-810, Shock, Method 516, Procedure I/V20 G, 11msec– functional shock; 40g 11msec crash hazard shock
MIL-S-901, Grade AWith solid state drives + shock kits
Electromagnetic Compatibility Standards
Some standards may require an internal kit
Designed to meet
IEC 61850-3International Standard Communication Networks and Systems for Power Utility Automation (covers environment and EMC concerns)
IEEE 1613Standard Environmental and Testing Requirements for Communications Networking Devices in Electric Power Substations
Emissionsradiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A
Mechanical
Form Factor1U
Height6.1 cm
Width40.64 cm
Depth27.94 cm
Weight3.41 Kg
Internal Expansion SlotsOne PCIe X16 low profile
 Removable Drives and I/OTwo (2) SATA 2.5” SSD (not externally removable), one (1) M.2 internal SSD
 CoolingFanless; passively cooled through heatpipe technology with no moving components
 MountingPanel mounting via ears on base 19” rack mount kit
 Power SupplyOption 1: 90-250 VAC 50/60 Hz with locking power cord
Option 2: 18-36 VDC
Option 3: 48 VDC
Option 4: 130 VDC
Software CompatibilityAccepts Windows 10®, RHEL® or VMware 6®
 Export ComplianceECCN: 5A992 | Classification is dependent on configuration and is subject to change.
Option 1:X10SDV-6C-TLN4F, Xeon D-1528 CPU, Up to 128 GB ECC DDR4, 2-USB 2.0, 2-GBLAN, IPMI, VGA, 1-PCIe x16
For further information, please contact us.

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