RE1112 Fanless Rugged Embedded Computer

The Crystal Group’s RE1112 Fanless Rugged Embedded Computer has an efficient heat-dissipating, solid-state design.  Which makes it an optimal solution for harsh environment automation applications such as oil & gas production, municipal utilities, mining operations and military systems. It provides a reliable and stable automation platform with minimum maintenance.

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The RE1112 Fanless Rugged Embedded Computer is designed for operation over an extended temperature range from -40°C to + 60°C.  Its special aluminium housing with cooling fins serves as a heat sink for conductive cooling of the internal electronics. The chassis is built to withstand the harsh environments for storage operations from -45°C to +85°C. The unit mounts to multiple DIN rail options and operates from a wide voltage range of 18-36 VDC power input.

The RE1112 Rugged Embedded Computer is powered by Intel® Core™i7 and is equipped with up to 16GB of RAM, and features one PCIe X16 low profile expansion card and offers on-board SATA2 and SATA3. The computer has two non-removable 2.5″ SSD hard drives and supports Linux®, VMWare®  and Windows® software.

The RE1112 Fanless Rugged Embedded Computer is designed for highly reliable performance in both military and industrial applications through a wide temperature range.

Features of the RE1112 Fanless Rugged Embedded Computer

  • Compact construction – 10”x 8” footprint, with multiple DIN rail mounting options
  • Two (2) 2.5” SSD hard drives, non-removable
  • i3 or i7 x86 Intel® CPU 2-16GB DDR3
  • VGA, Serial 2-4 GBLAN,2-4 USB 2.0 or USB 3.0 ports
  • Expandable with one (1) low-profile PCIe x16 slot, up to eight (8) G-BLAN
  • Fanless, no moving parts, high reliability

Specifications of the RE1112 Fanless Rugged Embedded Computer

 

Environmental Standards
MIL-STD-810, Operational Temperature:

-40°C to +60°C

MIL-STD-810, Storage, Method 501, Procedure I/II:

-40°C to +85°C

Electromagnetic Compatibility Standards
IEC 61850-3 (optional kit)
IEEE-1613 (optional kit)
Emissions: FCC Class A
Mechanical
Height
20.32 cm
Width
8.57 cm
Depth
25.4 cm
Weight:
3.63 Kg
CPU
Intel CPU architecture options from Intel embedded long-life roadmap
Dual core i7-3555LE
Dual core i3-3217UE
Dual core i7-3517UE
Internal Expansion Slots
One PCIe X16 low profile
Removable Drives and I/O
One or two 2.5″ SSD, up to 1 TB (not externally removable)
Cooling

Natural convection, fanless. Rated for extreme industrial environments.

Mounting
Multiple DIN rail mounting options
Power Supply
120W 18-36 VDC
System Board
Option 1:

X9SPV-LN4F-3LE, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 4-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 2:

X9SPV-F-3217UE, FCBGA1023, i3- 3217UE CPU, 2-16 GB ECC DDR3, 2-USB
2.0, 2-GBLAN, On-board SATA2 & SATA3

Option 3:

X9SPV-M4, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 4:

X9SPV-M4-3UE, FCBGA1023, i7-3517UE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Software Compatibility
Accepts VMware®, Linux® or Windows®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change.
For further information, please contact us.

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