Rugged Embedded Computer for Airborne Applications

The Crystal Group RE1312 Rugged Embedded Computer for Airborne and Mobile Computer Systems is able to withstand unstable power sources and a variety of shock and vibration conditions.  It offers reliable high compute processing ability while taking up a limited amount of space and weighing only 3.17 kg.

It’s a perfect fit for data intensive applications including signal intelligence, surveillance, reconnaissance, and transit case integration.

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Rugged Embedded Computer for Airborne Applications

The RE1312 is a lightweight, highly reliable Rugged Embedded Computer for Airborne and Mobile applications.  It has the capability to bring powerful compute processing to a variety of transportation platform applications.

Features of RE1312 Rugged Embedded Computer for Airborne & Mobile Applications

• Compact construction – 11.43 cm H x 30.48 cm W x 22.86 cm D footprint
• Compact composite construction provides low SWaP
• 7th Generation i7®/Broadwell-DE, Xeon®-D CPU technology
• Dual and Quad Core i7 CPU options/ up to 16 cores Xeon-D
• 18-36 VDC power
• Up to 32GB unbuffered, non ECC DDR4 1.2V SO-DIMM or 128GB ECC DDR4 with Xeon-D offering
• Two 15mm SSD or three 7/9mm SSD storage options, removable drives
• MIL-STD-461 CE102, RE102 compliant
• Bulk head or tray mounted options

Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +60°C

MIL-STD-810, Storage, Method 501, Procedure I/II

-40°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

5.5GRMS, 5-500Hz, 60 min/axis, 3 axes with vibration kit

Electromagnetic Compatibility Standards
Some standards may require an internal kit
MIL-STD-461, CE102, RE102
Mechanical
Dimensions: Height 11.43cm x Width 30.48 cm x Depth 22.86 cm
Weight: 3.41 kgs
Power: 55-80W with select configurations, CPU dependent
Internal Expansion Slots
One (1) PCIe 3.0×16 low profile expansion bay
Removable Drives and I/O
Up to three (3) SATA 2.5″ SSD (externally removable)
Cooling

Three (3) high reliability 60mm fans

Mounting
Tray or bulkhead mounted using ears supplied
Power Supply
18-36 VDC
Other options under development
System Board
Option 1

X11SSV-Q, LGA 1151, Mini-ITX, H4 i7/i5/i3, DP, HDMI, DVI-I, 2X 1G LAN, 5X SATA3, 2X Serial, HD audio, 1X PCI-E 3.0 X 16, 6x USB 3.0

Option 2

X10SDV-6C-TLN4F, FCBGA 1667, Mini-ITX, Xeon-D 1528, 6 Cores, 2x 1GB LAN, 2x 10G LAN, 1x PCI-E 3.0 x 16

Software Compatibility
Accepts Windows 10®, Ubuntu®, RHEL 6.6®, RHEL 6.7®, RHEL 7®, RHEL 7.1®, SUSE SLES 11®, Centos 7.1® or Windows Server 2016®
Export Compliance
For more information, contact us.

 

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